Comparative analysis of co plating process and reduction process for electroplated hole lines of electric heating tubes

Comparative analysis of co plating process and reduction process for electroplated hole lines of electric heating tubes

In the metallization process of conducting holes, both the hole wire co plating process and the reduction method process are made using electroplating thickening method, but the hole wire co plating process has obvious advantages. The hole line co plating process for graphic electroplating involves simultaneously thickening the wall of the conductive hole and the copper thickness of the circuit, resulting in higher production efficiency; The reduction method process uses whole plate electroplating, which not only increases the thickness of the copper layer on the wall of the through hole, but also increases the thickness of the copper layer on the surface, increasing the difficulty of subsequent etching and making circuits.

In the production of fine circuits, the hole line co plating process uses electroplating to thicken the circuit first, and then uses H2SO4-H2O2 etching solution to quickly remove the thinner copper foil in the non circuit part to complete the production of fine circuits. The resulting side corrosion of the circuit is very small, and the cross-section of the circuit is basically rectangular; The reduction method process uses chemical etching to remove copper foil from non circuit parts to produce fine circuits. Due to the generally thicker thickness of copper foil in the reduction method, the side corrosion problem of the circuit is more serious, and the cross-section of the circuit is in a ladder shape. In the experiment, PCB special adhesive tape produced by 3M Company in the United States was evenly applied to the fine circuit part produced by the hole line co plating process. The tape was quickly removed and the above steps were repeated 3 times. It was found that there were no traces of copper foil peeling off on the tape, indicating a good bonding between the circuit coating and the substrate. Figures 5 and 6 show the cross-sectional slices of fine circuits produced using the hole line co plating process and the traditional reduction method, respectively. From Figure 5 and Figure 6, it can be seen that the hole line co plating method avoids the problem of severe side corrosion in the reduction method for producing fine circuits, and the cross-sectional slices are in a rectangular shape, improving the quality of circuit production.

www.superbheater.com