Electroplating pure palladium electroplating

Electroplating pure palladium electroplating

Ni can cause dermatitis, and the EU has long rejected the import of Ni-containing jewelry. Palladium is the best substitute for Ni. This project was completed in 1997, including two processes, one is thin palladium electroplating with a thickness of 0.1~0.2μm, which has been used as an anti-corrosion decorative coating and an anti-silver discoloration layer on cupronickel tin; the other is thick palladium electroplating with a thickness of 3μm No cracks (the current international level), because palladium is expensive, it has not yet entered the domestic market.

Electroplating Non-Formaldehyde Autocatalytic Electroless Copper Plating

For through-hole plating and non-conductor surface metallization of circuit boards. Eliminate toxic formaldehyde and replace it with cheap and non-toxic hypophosphite. At present, there is no commercial product at home and abroad. Laboratory research has been basically completed, the deposition rate is 3~4μm/h, the life is more than 10 cycles (MTO), and the coating is dense and bright. However, it needs to be further improved and tested in the pilot test.

Electroplating cyanide-free autocatalytic electroless gold plating

The main salt is Na3[Au(SO3)2], and the thickness of the gold layer can reach 1.5μm, which has been used for gold plating on high-density flexible circuit boards and electronic ceramics.

Electroplating cyanide-free bright silver plating

The common type uses thiosulfate as the main complexing agent, and the advanced type uses sulfur-free organics as the main complexing agent. The thickness of the full bright coating can reach more than 40μm, the surface resistance of the coating is ~41μΩ·cm, the hardness is ~HV101.4, and the thermal shock is qualified at 250℃, which is very close to the performance of cyanide silver plating.

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