Electroplating Silver Technology for Electric Heating Tubes

Electroplating Silver Technology for Electric Heating Tubes

1. Introduction

Due to the tendency of silver to form insoluble salts with many compounds. Therefore, the stability of silver in the plating solution is poor, which can easily cause the solution to decompose. Due to the fact that silver is a precious metal in electrochemistry, it is difficult to form alloy coatings with other metals. Therefore, the types of silver alloy plating solutions are relatively limited. Most of the existing silver gold plating solutions are alkaline solutions containing cyanide, which is highly toxic. Given the above situation, this article describes the high safety silver and silver alloy plating solutions.

2. Process Overview

Silver and silver alloy plating baths contain soluble silver salts and alloy components such as metal salts, acids, and surface activity

Electroplated silver plated copper based electrical components

Electroplated silver plated copper based electrical components

Agents, brighteners, and pH adjustment agents. The addition of cationic, anionic, amphoteric, or non ionic surfactants to the plating solution aims to improve its performance. They can be used alone or in combination, with a concentration of 0.1-50 g/L. Adding brighteners or semi brighteners to the plating solution aims to improve the bright appearance of the coating. Suitable brighteners include p. naphthol, 0 naphthol, 6 sulfonic acid, B naphthalene sulfonic acid, m-chlorobenzaldehyde, p-nitrobenzaldehyde, and p-hydroxybenzaldehyde. Suitable semi brighteners include gelatin and peptone. Smoothing agents such as o-phenanthroline compounds or bipyridine compounds are also added to the bath, aiming to obtain flat, precise and dense coatings within a wide range of current density. The total concentration of brightener, semi brightener, and smoothing agent is 0.01-20 g/L. The addition of auxiliary complexing agents in the plating solution aims to improve the stability of the plating solution, and a hidden complexing agent is also added to the plating solution, aiming to suppress the eutectoid of impure metal ions dissolved from the metal substrate of the plating piece in the plating layer, while also inhibiting the deterioration of the plating solution.

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