High-speed and low-temperature sputtering method for vacuum silver plating

High-speed and low-temperature sputtering method for vacuum silver plating

Sputtering usually refers to magnetron sputtering, which is a high-speed low-temperature sputtering method. The process requires a vacuum degree of about 1×10-3Torr, that is, a vacuum state of 1.3×10-3Pa is filled with inert gas argon (Ar), and is added between the plastic substrate (anode) and the metal target (cathode). When the high voltage direct current is applied, the electrons generated by the glow discharge excite the inert gas to generate plasma, and the plasma blasts the atoms of the metal target material and deposits them on the plastic substrate. Generally, DC sputtering is used for most metal coatings, while RF AC sputtering is used for non-conductive ceramic materials.

Ion plating is a method in which gas or evaporated substances are partially ionized by gas discharge under vacuum conditions, and the evaporated substances or their reactants are deposited on the substrate under the bombardment of gas ions or evaporated substance ions. These include magnetron sputtering ion plating, reactive ion plating, hollow cathode discharge ion plating (hollow cathode evaporation method), multi-arc ion plating (cathode arc ion plating), etc.

Basic method of vacuum silver plating PVD

Basic PVD methods: vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive reactive ion plating, radio frequency ion plating, DC discharge ion plating). PVD technology is a high-tech and widely used ion plating technology in the world. It has the characteristics of dense and uniform coating layer, strong adhesion, good plating property, fast deposition speed, low processing temperature and wide range of plated materials. The best choice for engineering.

Vacuum Silver PVD-Physical Vapor Deposition

PVD-Physical Vapor Deposition: Refers to the process of transferring atoms or molecules from the source to the surface of the substrate by using physical processes to achieve material transfer. Its function is to spray some particles with special properties (high strength, wear resistance, heat dissipation, corrosion resistance, etc.) on the matrix with lower performance, so that the matrix has better performance.

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