Selection Points of Thermocouples for Low-temperature Slow-curing Plastic Molding Mar 26, 2026

Unlike traditional high-temperature models, low-temperature slow-curing polymers require focused thermocouple selection due to their low melting point, slow curing time, and sensitive heat change.

Select high-sensitivity, low-temperature thermocouples first. Because of their low thermal inertia, these devices can precisely record minute temperature variations between 120°C and 220°C, preventing excessive temperature fluctuations that could compromise the regularity of material curing.

Second, use wire materials that are resistant to low-temperature embrittlement. Ordinary wires easily become hard and brittle in a long-term low-temperature operating environment. Core wire fracture during mold movement can be avoided with special flexible low-temperature resistant wires.

Third, a smooth, non-stick probe construction is preferred. Viscous attachments are easily precipitated at steady low temperatures in slow-curing materials. Smooth, polished probes can sustain long-term, precise measurement while lowering adhesion and cleaning frequency.

Fourth, align constant-temperature models with low drift. Extremely little thermal drift is necessary for long-term storage at a fixed low temperature in order to guaranty constant melt fluidity in every batch and a steady degree of product curing.

When designing a plan, place measuring points near the flow channel outlet, monitor the actual glue outlet temperature in real time, work with a slow heating and cooling process, and successfully prevent flaws such uneven product hardness and incomplete curing.