Sensor miniaturization and chip technology

Micro-electromechanical system (MEMS) is a micro-system or device that integrates micro-mechanisms, micro-sensors, micro-actuators, control circuits, signal processing, communication, interfaces, power supplies, etc. It is a technology for designing, processing, manufacturing, measuring and controlling micro/nano materials.

MEMS technology includes: silicon micromachining technology, deep reactive ion etching, LIGA technology, molecular assembly technology, bulk micromachining, surface micromachining, laser micromachining and micro-packaging technology.

Silicon micromachining technology is the mainstream technology of MEMS. It is a precision three-dimensional processing technology. It is a technology for developing sensors, micro-actuators, micro-actuators, and micro-mechanical systems. It has been successfully used to manufacture various micro-sensors and multi-functional sensitive element arrays. Such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, dynamic sensors and micro-sensors for aerospace, automotive pressure and acceleration sensors, environmental protection micro-chemical sensors, etc.

Integration technology of sensor arrays and multi-sensing parameter composites

Integration refers to the integration of multiple sensing functions with data processing, storage, two-way communication, etc. Such as pressure, static pressure, temperature three-variable sensor; air pressure, wind force, temperature, humidity four-variable sensor; micro silicon composite strain pressure sensor and array sensor, etc., all use integration technology. Integration process and multi-variable composite sensor microstructure integrated manufacturing process, such as pressure, static pressure, temperature three-variable sensor, air pressure, wind force, temperature, humidity four-variable sensor, micro silicon composite strain pressure sensor, array sensor.

There are two types of sensor integration: one is to build multiple sensor modules on a chip through micro-machining technology to form a linear sensor (such as CCD image sensor); the other is to make sensitive components with different functions on the same silicon chip to make an integrated multifunctional sensor with high integration, small size, and easy compensation and correction.