ACF bonding equipment

ACF bonding equipment is a device that precisely positions the IC chip on the LCD glass and binds it. The whole machine consists of PLC+HMI as the control core. After the product is aligned and pre-pressed, the product is transferred from the platform to the local pressure for binding. crimp. The IC is directly bonded to the LCD screen by hot pressing using ACF (an anisotropic conductive adhesive). The entire module after bonding is also connected to the PCB board through FPC (flexible printed circuit board) or metal pins. LCD screen, ACF, and driver IC are the three key components of COG.