MAT's automatic die bonding machine equipment can be applied to:

epoxy bonding process, eutectic bonding process, ultrasonic thermocompression bonding process, flip-chip bonding process, suitable for chip packaging, multi-chip modules (MCM), micro-electronic mechanical devices (MEMS) ), 3D chip packaging (Die Stacking), sensors and CCD sensitive devices, etc., different application processes depend on the configuration requirements of customers for equipment.