Selection of high-frequency power supply and workpiece requirements for blister packaging

The choice of power supply is related to the depth of the heating layer required by the workpiece. For workpieces with a deep heating layer, a power supply device with a lower current frequency should be used; for a workpiece with a shallow heating layer, a power supply device with a higher current frequency should be used. Another criterion for selecting a power supply device is the device power. The heating surface area increases, and the required power supply increases accordingly. When the heating surface area is too large or the power supply is insufficient, the continuous heating method can be used to make the workpiece and the inductor move relatively, heating at the front and cooling at the back. However, it is better to heat the entire heating surface at once. In this way, the hardened surface layer can be tempered by using the residual heat of the workpiece core, thereby simplifying the process and saving electric energy.