Vacuum electroplating electric heating tube, the loss rate of large and small parts is different
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Vacuum electroplating electric heating tube, the loss rate of large and small parts is different
Generally speaking, the current general loss rate standard in the vacuum electroplating industry is usually 20%-25%, and the loss rate of large-sized parts and complex structural parts is slightly higher, which may generally reach 30%-35%; small-sized parts, small appearance surface After continuous process optimization and improvement, the process loss rate may also be reduced to 15%-10% under ideal conditions, which is already a very remarkable finished product pass-through rate for the vacuum electroplating industry.
Vacuum plating electric heating tube 25% vacuum plating processing loss rate
After the study and hard work of countless professional and technical personnel in the vacuum electroplating industry, continuous attempts have been made to improve in terms of environmental purification, dust removal, and process optimization. At present, the yield rate of a single UV spraying process in the vacuum electroplating processing industry has reached more than 90%. Without calculating the loss of the coating process and other processes, according to the general two-coat UV vacuum plating process, the pass-through rate of the finished product is: 1×90%×90%=81%, and the loss rate is 19%. Go back and count the normal loss rate of the coating process of 1%-2%, material inspection and trial plating loss, first piece loss in each process, performance test product loss, customer spare parts loss, process drop loss, etc., 25% of vacuum plating The processing loss rate is more scientific and reasonable.
Instantaneous Evaporation of Vacuum Electroplating Electric Heating Tube
The fine alloy particles are sent to a very hot surface and the particles evaporate immediately. Due to the high gas content of the fine alloy, the rapid release of the gas will increase the pressure of the vacuum chamber. As a result, unmelted particles leave the evaporation source and impinge on the substrate.
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