Shenzhen International Semiconductor And Display Technology Exhibition SEMI-e

Exhibition introduction
Shenzhen International Semiconductor and Display Technology Exhibition (SEMI-e) in 2023, exhibition time: May 16 to May 18, 2023, exhibition venue: Shenzhen International Convention and Exhibition Center (Bao'an New Hall), No. 1, Zhancheng Road, Fuhai Street, Bao'an District, China, organizer: Shenzhen Semiconductor Industry Association, Shenzhen China New Materials Exhibition Co., Ltd., holding period: once a year, exhibition area: 55000 square meters, exhibition audience: 50000 people, The number of exhibitors and participating brands reached 800.
With the theme of "Core Opportunities · Smart Future", SEMI-e gathered many industry experts and scholars to further strengthen the exchange and cooperation of the global integrated circuit industry. Centering on China's international integrated circuit industry and application, based in Shenzhen and radiating across the country, SEMI-e aims to focus on displaying the development achievements of the integrated circuit industry, and accelerate the breakthrough in key links of the industrial chain such as high-end chip design, key devices, core equipment materials, EDA design tools, etc, Strengthen the cooperation of the industrial chain in the Pearl River Delta, gradually form a comprehensive integrated circuit industrial cluster, create a platform for the exchange and trade of the integrated circuit industry in South China, and promote the faster and better development of the integrated circuit industrial cluster in South China.
This exhibition conforms to the industrial development trend and serves more than ten emerging industries. With an exhibition area of 55000 square meters, more than 800 exhibitors will gather to display the semiconductor industry chain integrating integrated circuits, electronic components, third-generation semiconductors and industrial chain materials and equipment. At the same time, several summit forums were held, with more than 80000 visitors covering integrated circuits, 5G applications, automotive electronics, industrial electronics, medical electronics, the Internet of Things, consumer electronics, smart appliances, new displays, industrial interconnection, intelligent manufacturing, artificial intelligence, wireless charging and other fields.
Scope of exhibits
Electronic components exhibition area: passive components, semiconductor discrete devices/IGBT 5G core components, special electronics, components, power management sensors, storage, connector relays, cables, patch devices, crystal oscillators, resistors, potentiometer magnetic components, filter components PCB boards, electrical fan electroacoustic devices, display devices diodes, transistor filter element switches, components materials and equipment, etc
IC design, chip exhibition area: IC and related electronic product design, artificial intelligence chip power management chip, Internet of Things chip 5G communication chip and solution automotive electronic chip, security control chip digital-analog hybrid communication RF chip, memory chip LED lighting and display driver chip, etc
Wafer manufacturing and packaging exhibition area: wafer manufacturing, SiP advanced packaging, OSATs EMS, OEMs, IDM, silicon wafer and IC packaging carrier board printed circuit board, packaging substrate and equipment, assembly and testing, and other packaging design, testing, equipment and application manufacturing and packaging EDA, MCU, printed circuit board packaging substrate semiconductor materials and equipment
Semiconductor equipment exhibition area: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine etching machine, ion implantation equipment, CVD/PVD equipment, solid crystal machine plasma cleaning equipment, cutting machine, loading machine, bonding machine, wire bonding machine reflow welding, wave soldering, testing machine, sorting machine, coupling airborne belt forming machine, detection equipment, constant temperature and humidity test box sensor, packaging mold, test fixture, precision sliding table stepper motor Valves, probe table cleaning room equipment, water treatment, etc
The third generation semiconductor zone: the third generation semiconductor silicon carbide SiC, gallium nitride GaN wafer, substrate, packaging, testing, optoelectronic devices (light emitting diode LED, laser LD, detector UV) power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.) microwave radio frequency devices (HEMT, MMIC)
Semiconductor material exhibition area: silicon wafer, silicon wafer, photoresist, wafer tape mask, electronic gas, CMP polishing material photoresist material, wet electronic chemicals, sputtering target sealing material, slice, abrasive, polishing sheet, film, etc