The selection and treatment of vacuum electroplating electric heating tube targets are very important

The selection and treatment of vacuum electroplating electric heating tube targets are very important

Pulse: widely used, the latest development of sputtering must control parameters such as sputtering current, voltage or power, and sputtering pressure (5×10-1—1.0Pa). If all parameters are stable, the film thickness can be estimated by the coating time come out. The selection and processing of the target material is very important, the purity should be good, the texture should be uniform, there should be no bubbles and defects, and the surface should be smooth and clean. For the direct cooling target, it should be noted that the target material becomes thinner after sputtering, and there is a possibility of cracking, especially for non-metallic targets. Generally, the thinnest part of the target should not be less than half or 5mm of the original target thickness.

The operation mode of magnetron sputtering is similar to that of general evaporation. First, the vacuum is pumped to 1 × 10-2Pa, and then argon (Ar) ions are introduced to bombard the target, and sputtering is carried out under the pressure of 5 × 10-1-1.0Pa. During plating, attention should be paid to current, voltage and pressure. If the sputtering sparks at the beginning, the voltage can be slowly increased, and the shutter can be turned off after a stable discharge. During this process, the ionized inert gas (Ar) cleans and exposes several capillary pores on the surface of the plastic substrate. , and generate a free radical by cleaning the surface of the electron and the self-plastic substrate, and maintain a vacuum state by sputtering to form a surface associative structure, so that the surface associative structure and free radicals generate chemical and high adhesion and high adhesion. Physically combined state to form a thin film firmly on the surface. The thin film is first formed by filling the plastic capillary pores with surface constructs and connecting them. Compared with the commonly used evaporation plating, sputtering is formed. , Sputtering has the advantages of strong bonding force between the electroplating layer and the substrate - the adhesion is more than 10 times higher than that of evaporation plating, and the electroplating has been dense and uniform.

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